MOLKA'S CPU COLLECTION

Collection > VIA > C3

VIA C3 733A EBGA
Manufacturer	VIA
Model	C3
Architecture	x86
Codename	Samuel 2
Core frequency	133 MHz
Targeted market	Laptop PCs
Package	EBGA-368
Physical informations
Package Size	3,5x3,5 cm	Manufacturing process	0,15 µm
Die size	52 mm²	Transistor count	15200000
Electrical informations
Bus frequency	133 MHz	Width	32 bits
Core/Bus ratio	5.5x	L1 cache (data+instruction)	64+64 KB
Voltage	1.65V	L2 cache	64 KB
Other informations
Functions/Features	3DNow! MMX VIA LongHaul
Collection's model
Manufacturing date	???/???
Manufacturing Country	Taiwan
Rarity

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